Koki solder paste manual

 · Exciting new relationship between Koki Soldering Solutions and Mycronic UK. Comments Off on Exciting new relationship between Koki Soldering Solutions and Mycronic UK Company News, Product launches and updates, Industry News Like. Following extensive testing, Koki solder paste S3XEDN, has been officially approved for global . Solder Paste Solder paste is an alloy or unalloyed metal which, when heated, liquefies and melts to flow into the space between two close fitting parts, creating a soldered joint. Solder paste has suitable melting and flow properties to permit distribution by capillary attraction in properly prepared joints. Hi-performance Lead Free Solder Paste S3XM series Features 1） Ensures OUTSTANDING continual PRINTABILITY with super fine pitch (mm/16mil) and CSP (mm dia.) applications and long stencil idle time. 2) PERFECT MELTING and wetting at super fine pitch .

Another Koki Solder paste about to complete the Mycronic approval process is our leaded SSEDN. This paste uses the 2% silver leaded alloy and will be a welcome new addition to both our paste range and for customers looking for leaded alloy jetting solder pastes suitable for use in the Mycronic equipment. Koki Company Limited is a global manufacturer and supplier of soldering materials for elecctronic and electrical www.doorway.ru Paste,unleaded,Liquid Flux for Wave / Selective Soldering,Tack Flux,Flux Cored Solder Wire,Heat Curable SMT Adhesive. Print the solder paste on AN alumina plate with a mm thick stencil that has five mm dia. holes, to obtain the test piece. Press the flat tip cylindrical probe of the Malcom Solder Checker FG-1 onto the printed solder paste with a pressure of 50gs for mm sec. and pull it back up at the speed of 10mm/sec. to measure the maximum.

Ejector, parameters and solder paste. Distributed* by Mycronic and direct by solder paste partners. Tamura. Koki. Indium. Jettable solder pastes. KOKI Powerful Wetting General Purpose Solder Paste, Is Good and Consistent Wetting Spreading to Oxidized Metal, Sn Ag Cu. Variations exhibited in solder paste characteristics make it increasingly Standard test method for slump taken from the test methods manual of IPC.